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- W2085833331 abstract "In the absence of cooling measures, the chip temperature of high power LED rises rapidly. When the junction temperature exceeds the maximum allowable temperature, the high power LED will be damaged due to overheating. In the design of high power LED lamps, the main work is to the temperature design. Using a good linear relationship characteristic of the semiconductor devices between the LED junction voltage and junction temperature, this paper measured the high-power LED working voltage, working current, temperature of the incubator and heat sink. Adopting the method of electrical parameters, the paper measure the temperature resistor of high power LED. The high-power LED temperature resistance measuring instrument is designed and made. The temperature resistance from the LED wafer to the heat sink is measured fast and accurately, and the error is less than 5%." @default.
- W2085833331 created "2016-06-24" @default.
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- W2085833331 date "2014-12-01" @default.
- W2085833331 modified "2023-09-27" @default.
- W2085833331 title "Measurement of Temperature Resistance of High Power LED" @default.
- W2085833331 doi "https://doi.org/10.4028/www.scientific.net/amm.701-702.510" @default.
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