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• W2086214101 abstract "Abstract The accurate measurement of growth and etch rates during plasma processing is difficult, if not impossible, to achieve for opaque, three-dimensional substrates. Sensing small weight changes that correspond to discontinuous film formation on a substrate is also difficult with traditional optical methods. Using a gravimetric recording microbalance, we have successfully measured small weight changes of aluminum samples during the pre-cleaning and nitriding stages in low temperature plasma. The data will show that the microbalance can provide useful information about the rates of various processes within a plasma. The data can be interpreted using reaction–diffusion equations to determine the relevant rate parameters for a plasma process. This approach can be extended to the study of many materials including oxides, metals, and nitrides subjected to various processes including etching and deposition." @default.
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• W2086214101 date "2002-10-01" @default.
• W2086214101 modified "2023-09-24" @default.
• W2086214101 title "In situ growth rate measurements for plasma processing of opaque materials" @default.
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• W2086214101 doi "https://doi.org/10.1016/s0040-6090(02)00696-x" @default.
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