FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2086723573> ?p ?o ?g. }

• W2086723573 endingPage "337" @default.
• W2086723573 startingPage "328" @default.
• W2086723573 abstract "The purpose of this paper is to experimentally, numerically, and theoretically investigate the thermomechanical behaviors of flip-chip ball grid array (BGA) packages with low- and high-T/sub g/ underfills under thermal loads, after 85/spl deg/C/85%RH conditions, and after solder reflow. The low- and high-T/sub g/ underfills all cured at 150/spl deg/C are with glass transition temperatures (T/sub g/) at 84/spl deg/C and 142/spl deg/C, respectively. The emphasis of the study is placed on the deformations and die stresses of the packages under these loading conditions. This paper has presented that Suhir's solution of a trimaterial assembly and finite-element method (FEM) can effectively predict the thermomechanical behaviors of both flip-chip BGA packages. It is also found from Twyman-Green experiments that the stress-free temperature is at underfill-curing temperature (T/sub c/) for both packages before solder reflow, but not after solder reflow. Furthermore, the relation between curvature and temperature is nearly linear for packages with high-T/sub g/ underfills, while bilinear (with turning point near T/sub g/) for those with low-T/sub g/ underfills. It is also discovered that the packages with low-T/sub g/ underfills during cooling processes suffer stress relaxation, and, thus, their deformations depend on cooling rate, but not for those with high-T/sub g/ underfills. The die stresses can be directly determined by Suhir's die stress solution associated with the curvature data from the experiments. The coplanarity of the packages with and without fillets has also been addressed by the FEM analyses combined with experiments. It is found that the fillet effect on the warpage is negligible for this flip-chip BGA and the 2-D axis-symmetrical model can be approximately used for addressing the global warpage. Regarding 85/spl deg/C/85%RH environmental effect, it is shown that the packages with high-T/sub g/ underfills are insensitive to this environmental effect, while those with low-T/sub g/ underfills are minor sensitive (about 10% decrease). It is also found that solder reflow process does affect the curvature of the packages by increasing 18% and 15% of the average curvature for those with high- and low-T/sub g/ underfills, respectively." @default.
• W2086723573 created "2016-06-24" @default.
• W2086723573 creator A5053469494 @default.
• W2086723573 creator A5055845845 @default.
• W2086723573 creator A5070237889 @default.
• W2086723573 creator A5079613253 @default.
• W2086723573 date "2005-10-01" @default.
• W2086723573 modified "2023-10-14" @default.
• W2086723573 title "Thermal deformations and stresses of flip-chip BGA packages with low- and high-T/sub g/ underfills" @default.
• W2086723573 cites W1483740618 @default.
• W2086723573 cites W1864280046 @default.
• W2086723573 cites W1908886214 @default.
• W2086723573 cites W1968924121 @default.
• W2086723573 cites W2073521671 @default.
• W2086723573 cites W2096857621 @default.
• W2086723573 cites W2098986515 @default.
• W2086723573 cites W2113641968 @default.
• W2086723573 cites W2127337285 @default.
• W2086723573 cites W2129779386 @default.
• W2086723573 cites W2131597737 @default.
• W2086723573 cites W2137039559 @default.
• W2086723573 cites W2162041926 @default.
• W2086723573 cites W2162295447 @default.
• W2086723573 cites W2171949338 @default.
• W2086723573 cites W2538721939 @default.
• W2086723573 cites W2564245057 @default.
• W2086723573 cites W4244236854 @default.
• W2086723573 cites W2148134018 @default.
• W2086723573 doi "https://doi.org/10.1109/tepm.2005.856536" @default.
• W2086723573 hasPublicationYear "2005" @default.
• W2086723573 type Work @default.
• W2086723573 sameAs 2086723573 @default.
• W2086723573 citedByCount "17" @default.
• W2086723573 countsByYear W20867235732012 @default.
• W2086723573 countsByYear W20867235732013 @default.
• W2086723573 countsByYear W20867235732014 @default.
• W2086723573 countsByYear W20867235732016 @default.
• W2086723573 countsByYear W20867235732018 @default.
• W2086723573 crossrefType "journal-article" @default.
• W2086723573 hasAuthorship W2086723573A5053469494 @default.
• W2086723573 hasAuthorship W2086723573A5055845845 @default.
• W2086723573 hasAuthorship W2086723573A5070237889 @default.
• W2086723573 hasAuthorship W2086723573A5079613253 @default.
• W2086723573 hasConcept C138885662 @default.
• W2086723573 hasConcept C149912024 @default.
• W2086723573 hasConcept C159985019 @default.
• W2086723573 hasConcept C192562407 @default.
• W2086723573 hasConcept C202974441 @default.
• W2086723573 hasConcept C21036866 @default.
• W2086723573 hasConcept C2779227376 @default.
• W2086723573 hasConcept C41895202 @default.
• W2086723573 hasConcept C50296614 @default.
• W2086723573 hasConcept C68928338 @default.
• W2086723573 hasConcept C79072407 @default.
• W2086723573 hasConcept C94709252 @default.
• W2086723573 hasConceptScore W2086723573C138885662 @default.
• W2086723573 hasConceptScore W2086723573C149912024 @default.
• W2086723573 hasConceptScore W2086723573C159985019 @default.
• W2086723573 hasConceptScore W2086723573C192562407 @default.
• W2086723573 hasConceptScore W2086723573C202974441 @default.
• W2086723573 hasConceptScore W2086723573C21036866 @default.
• W2086723573 hasConceptScore W2086723573C2779227376 @default.
• W2086723573 hasConceptScore W2086723573C41895202 @default.
• W2086723573 hasConceptScore W2086723573C50296614 @default.
• W2086723573 hasConceptScore W2086723573C68928338 @default.
• W2086723573 hasConceptScore W2086723573C79072407 @default.
• W2086723573 hasConceptScore W2086723573C94709252 @default.
• W2086723573 hasIssue "4" @default.
• W2086723573 hasLocation W20867235731 @default.
• W2086723573 hasOpenAccess W2086723573 @default.
• W2086723573 hasPrimaryLocation W20867235731 @default.
• W2086723573 hasRelatedWork W1839374869 @default.
• W2086723573 hasRelatedWork W2050959455 @default.
• W2086723573 hasRelatedWork W2079246348 @default.
• W2086723573 hasRelatedWork W2145241099 @default.
• W2086723573 hasRelatedWork W2145849274 @default.
• W2086723573 hasRelatedWork W2147755341 @default.
• W2086723573 hasRelatedWork W2532553300 @default.
• W2086723573 hasRelatedWork W2539013570 @default.
• W2086723573 hasRelatedWork W2901438724 @default.
• W2086723573 hasRelatedWork W2996413524 @default.
• W2086723573 hasVolume "28" @default.
• W2086723573 isParatext "false" @default.
• W2086723573 isRetracted "false" @default.
• W2086723573 magId "2086723573" @default.
• W2086723573 workType "article" @default.