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- W2086771747 abstract "Sn–3.8Ag–0.7Cu-based composite solders functionalized with single-wall carbon nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1 wt% were successfully produced. The microstuctural, melting and mechanical properties of Sn–3.8Ag–0.7Cu-based composite solders were evaluated as a function of different wt% of SWCNT addition. The microstructures of the composite specimens were studied by means of field-emission scanning electron microscope (FE-SEM). It was observed that SWCNTs were homogeneously distributed at the edges of Ag3Sn compounds that are distributed evenly in the β-Sn solder matrix. Energy dispersion X-ray (EDX) analysis method was employed to reveal the presence of the phases existed in the solder composites. The mechanical properties of the composite solders were evaluated by Vickers-microhardness measurements and tensile tests performed at room temperature. The different wt% and addition of SWCNTs to Sn–3.8Ag–0.7Cu produced a dramatic increase in tensile strength, hardness, and better melting characteristics. A slight decrease in elongation to failure was observed. FE-SEM observations of the fracture surface, revealed the overall failure mechanism as the ductile manner of failure." @default.
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- W2086771747 date "2008-02-01" @default.
- W2086771747 modified "2023-10-15" @default.
- W2086771747 title "Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders" @default.
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- W2086771747 doi "https://doi.org/10.1016/j.jallcom.2006.10.123" @default.
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