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- W2087492166 abstract "An inspection process based on scanned-beam X-ray laminography (SBXLAM) is proposed herein for quantitatively monitoring the quality of ball-grid-array (BGA) joints. The long-term reliability of the BGA joints depends on the component-assembly process producing joints with sufficient solder volume and proper alignment. Inspection algorithms were developed to measure the critical BGA-joint characteristics, including the alignment between the ball and the PCB pad, the solder thickness, and the average joint-diameter, and thus, determine whether the joints are defective. The performance of the inspection algorithms was evaluated by inspecting samples with defects that were independently verified." @default.
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- W2087492166 date "1995-01-01" @default.
- W2087492166 modified "2023-10-09" @default.
- W2087492166 title "Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography" @default.
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- W2087492166 doi "https://doi.org/10.1109/95.477473" @default.
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