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- W2088099055 abstract "The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase-shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames." @default.
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- W2088099055 date "2006-01-01" @default.
- W2088099055 modified "2023-09-27" @default.
- W2088099055 title "High-Accuracy Measurement on Thermal Displacement and Strain Distributions of Electronic Packaging" @default.
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- W2088099055 doi "https://doi.org/10.1541/ieejeiss.126.871" @default.
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