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• W2088311759 abstract "The interdiffusion of gold and tin thin films was studied, with special emphasis on the influence of the substrate temperature during evaporation. A special target chamber makes it possible to evaporate several films in succession and to analyse them by Rutherford backscattering at any stage in the interdiffusion process without exposing the specimens to the atmosphere. The samples can be kept at any temperature between -170 and +150°C during the evaporation, the heat treatment and the analysis. The interdiffusion of Au/Sn films is complex, with several competing processes going on at the same time. If the tin is evaporated at low temperatures, the initial stage of the interdiffusion will be dominated by grain boundary diffusion of gold into the tin film followed by diffusion into the tin grains, resulting in the formation of the AuSn4 phase. The growth of the AuSn4 phase was found to be linear with time. Concurrently the AuSn phase grows in a planar manner from the original interface. The thickness of this phase grows as t12 and is believed to be limited mainly by the grain boundary diffusion of gold through the AuSn phase. This diffusion has an activation energy Ea = 0.59±0.06eV. When the substrate temperature during evaporation of the tin film is decreased, we observe an increase in the growth rate of the AuSn phase. This is believed to be caused by the decrease in grain size." @default.
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• W2088311759 date "1982-12-01" @default.
• W2088311759 modified "2023-10-18" @default.
• W2088311759 title "Interdiffusion and phase formation in Au/Sn thin film couples with special emphasis on substrate temperature during condensation" @default.
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• W2088311759 doi "https://doi.org/10.1016/0040-6090(82)90275-9" @default.
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