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• W2089404584 abstract "One three-dimensional (3-D) carbon-based heterogeneous interconnect scheme, consisting of a couple of horizontal multilayer graphene transmission lines (MLG-TL) and vertical through silicon carbon nanotube bundle vias (TS-CNTBV), is proposed and investigated theoretically. For its realization, some metallic bumps are used to integrate MLG-TLs with TS-CNTBVs, and contact resistance among them are characterized and compared. The lumped-element circuit model of a couple of MLG-TLs is also combined with that of TS-CNTBVs, with anomalous skin effect treated in an appropriate way. Numerical studies are performed for capturing distributed parameters as well as transmission characteristics of MLG-TLs, TS-CNTBVs, and whole 3-D interconnects at different operating frequencies. It is believed that this study can provide some useful information about carbon-based heterogeneous interconnects, where both graphene and carbon nanotube advantages can be exploited for the future 3-D ICs." @default.
• W2089404584 created "2016-06-24" @default.
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• W2089404584 date "2014-05-01" @default.
• W2089404584 modified "2023-09-22" @default.
• W2089404584 title "Electrical Modeling of Three-Dimensional Carbon-Based Heterogeneous Interconnects" @default.
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• W2089404584 doi "https://doi.org/10.1109/tnano.2014.2307344" @default.
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