Matches in SemOpenAlex for { <https://semopenalex.org/work/W2089652555> ?p ?o ?g. }
Showing items 1 to 82 of
82
with 100 items per page.
- W2089652555 abstract "The aim of present research is to investigate the interfacial nanoscale bondability between copper and Aluminum intermetallic compound (IMC) for copper wire and aluminum pad. In addition, the growth mechanism of IMC layer is carefully examined. Preliminary results demonstrated that IMC cracks from the edge of bonding interface and spreads into the center area. This is the cause of open fail. The IMC between Cu and Al was initially generated in the form of CuAl2, and gradually increased the content of Cu and turned into CuAl when the working temperature was increased. The final stage of IMC growth is Cu9Al4 and the aluminum pad will be vanished as the result of Cu diffusivity. Bondability on nanoscale IMC of CuAl2, CuAl and Cu9Al4 are also cautiously investigated by using a special self-designed pull test fixture. Nanoscale atomic modulus and rupture strength are validated by using molecular dynamics (MD) simulations. Atomic-level tensile stress and tensile strain are predicted to examine the bonding strength of two IMCs along the bonding interface. Temperature and tensile speed are two major factors on determining the bonding strength. Material in high temperature has greater kinetic energy and has better formability. Higher pulling speed in tensile test would results in material easier fracture. Interfacial fracture is different in different tensile speed as well as the working temperature. A series of experimental works and MD simulations are conducted in this research." @default.
- W2089652555 created "2016-06-24" @default.
- W2089652555 creator A5005502657 @default.
- W2089652555 creator A5027248595 @default.
- W2089652555 creator A5027372879 @default.
- W2089652555 creator A5034533509 @default.
- W2089652555 creator A5035196767 @default.
- W2089652555 creator A5035723894 @default.
- W2089652555 creator A5061294248 @default.
- W2089652555 date "2013-10-01" @default.
- W2089652555 modified "2023-09-23" @default.
- W2089652555 title "An investigation on nanoscale bondability between Cu-Al intermetallic compound" @default.
- W2089652555 cites W1993969616 @default.
- W2089652555 cites W2014829440 @default.
- W2089652555 cites W2027053193 @default.
- W2089652555 cites W2043109825 @default.
- W2089652555 cites W2059527620 @default.
- W2089652555 cites W2092668019 @default.
- W2089652555 cites W2153669893 @default.
- W2089652555 cites W2275377545 @default.
- W2089652555 cites W2543831348 @default.
- W2089652555 doi "https://doi.org/10.1109/impact.2013.6706686" @default.
- W2089652555 hasPublicationYear "2013" @default.
- W2089652555 type Work @default.
- W2089652555 sameAs 2089652555 @default.
- W2089652555 citedByCount "3" @default.
- W2089652555 countsByYear W20896525552014 @default.
- W2089652555 countsByYear W20896525552019 @default.
- W2089652555 countsByYear W20896525552021 @default.
- W2089652555 crossrefType "proceedings-article" @default.
- W2089652555 hasAuthorship W2089652555A5005502657 @default.
- W2089652555 hasAuthorship W2089652555A5027248595 @default.
- W2089652555 hasAuthorship W2089652555A5027372879 @default.
- W2089652555 hasAuthorship W2089652555A5034533509 @default.
- W2089652555 hasAuthorship W2089652555A5035196767 @default.
- W2089652555 hasAuthorship W2089652555A5035723894 @default.
- W2089652555 hasAuthorship W2089652555A5061294248 @default.
- W2089652555 hasConcept C112950240 @default.
- W2089652555 hasConcept C159985019 @default.
- W2089652555 hasConcept C182508753 @default.
- W2089652555 hasConcept C191897082 @default.
- W2089652555 hasConcept C192562407 @default.
- W2089652555 hasConcept C27501479 @default.
- W2089652555 hasConcept C2780026712 @default.
- W2089652555 hasConcept C544778455 @default.
- W2089652555 hasConcept C79127381 @default.
- W2089652555 hasConceptScore W2089652555C112950240 @default.
- W2089652555 hasConceptScore W2089652555C159985019 @default.
- W2089652555 hasConceptScore W2089652555C182508753 @default.
- W2089652555 hasConceptScore W2089652555C191897082 @default.
- W2089652555 hasConceptScore W2089652555C192562407 @default.
- W2089652555 hasConceptScore W2089652555C27501479 @default.
- W2089652555 hasConceptScore W2089652555C2780026712 @default.
- W2089652555 hasConceptScore W2089652555C544778455 @default.
- W2089652555 hasConceptScore W2089652555C79127381 @default.
- W2089652555 hasLocation W20896525551 @default.
- W2089652555 hasOpenAccess W2089652555 @default.
- W2089652555 hasPrimaryLocation W20896525551 @default.
- W2089652555 hasRelatedWork W1971185850 @default.
- W2089652555 hasRelatedWork W1983554878 @default.
- W2089652555 hasRelatedWork W1996991230 @default.
- W2089652555 hasRelatedWork W2046699729 @default.
- W2089652555 hasRelatedWork W2055689649 @default.
- W2089652555 hasRelatedWork W2059048160 @default.
- W2089652555 hasRelatedWork W2061173782 @default.
- W2089652555 hasRelatedWork W2106425568 @default.
- W2089652555 hasRelatedWork W2153669893 @default.
- W2089652555 hasRelatedWork W2262479568 @default.
- W2089652555 hasRelatedWork W2275377545 @default.
- W2089652555 hasRelatedWork W2288753274 @default.
- W2089652555 hasRelatedWork W2354914319 @default.
- W2089652555 hasRelatedWork W2383537704 @default.
- W2089652555 hasRelatedWork W2482964408 @default.
- W2089652555 hasRelatedWork W2751770988 @default.
- W2089652555 hasRelatedWork W2895769906 @default.
- W2089652555 hasRelatedWork W3096192808 @default.
- W2089652555 hasRelatedWork W3213707771 @default.
- W2089652555 hasRelatedWork W401890686 @default.
- W2089652555 isParatext "false" @default.
- W2089652555 isRetracted "false" @default.
- W2089652555 magId "2089652555" @default.
- W2089652555 workType "article" @default.