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• W2090212096 abstract "Silicide formation induced by thermal annealing in Ni/Si thin film system has been investigated using glancing incidence X-ray diffraction (GIXRD) and Auger electron spectroscopy (AES). Silicide formation takes place at 870 K with Ni2Si, NiSi and NiSi2 phases co-existing with Ni. Complete conversion of intermediate silicide phases to the final NiSi2 phase takes place at 1170 K. Atomic force microscopy measurements have revealed the coalescence of pillar-like structures to ridge-like structures upon silicidation. A comparison of the experimental results in terms of the evolution of various silicide phases is presented." @default.
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• W2090212096 date "2007-02-01" @default.
• W2090212096 modified "2023-10-01" @default.
• W2090212096 title "Silicidation in Ni/Si thin film system investigated by X-ray diffraction and Auger electron spectroscopy" @default.
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• W2090212096 doi "https://doi.org/10.1016/j.apsusc.2006.07.091" @default.
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