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• W2090375735 abstract "The mechanical response of an anisotropic, elastic substrate subjected to an edge force on its surface was used to develop simple, analytical expressions of stress distributions for selected orientations of a substrate possessing cubic symmetry. The resulting stress distributions, calculated for both (001) and (011) orientations of a Si substrate, can differ by 20% from those predicted for an elastically isotropic case. Elastic anisotropy of strained films on a Si substrate, which produce variations in the film stress, leads to a 34% increase in SiGe film stress along [01¯1] in the (011) orientation relative to the (001) orientation. Both of these effects are incorporated into a distributed-force formulation of the elastic relaxation at the edges of strained film features to model the stress distributions across SiGe features on Si." @default.
• W2090375735 created "2016-06-24" @default.
• W2090375735 creator A5083017466 @default.
• W2090375735 date "2006-11-15" @default.
• W2090375735 modified "2023-09-27" @default.
• W2090375735 title "Mechanics of edge effects in anisotropic thin film∕substrate systems" @default.
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• W2090375735 doi "https://doi.org/10.1063/1.2369642" @default.
• W2090375735 hasPublicationYear "2006" @default.
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