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• W2090395280 abstract "We report a copper electrodeposition with a microscopic structure of a regular ladder pattern on a silicon substrate where the ladder formation and evolution can be controlled by varying the electric field intensity during the electrodeposition. The deposit morphology varies from a periodic square-island structure to a ladder structure when the applied current is changed. The formation of a ladder structure with nanoparticles is related to the periodic potential measured across the electrodes. This method provides a deep insight into pattern formation in electrodeposition." @default.
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• W2090395280 date "2007-12-29" @default.
• W2090395280 modified "2023-10-15" @default.
• W2090395280 title "Direct Electrodeposition of Copper Ladder Structures on a Silicon Substrate" @default.
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• W2090395280 doi "https://doi.org/10.1021/cg070200n" @default.
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