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- W2090901724 abstract "This paper will review the important characteristics of ion beam etching, how they have affected the current state of production equipment and review some important factors that may determine future capabilities. A typical ion beam etching system consists of a gun or ion source operating at 4×10−5 torr, a work chamber at 7×10−5 torr, a fixture for the wafers, a vacuum system, a power supply for the gun, and a means of monitoring the etching progress; the main difference between ion beam etching and conventional sputter etching is the use of a directed ion beam and a work chamber at a relatively low pressure. (AIP)" @default.
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- W2090901724 date "1979-03-01" @default.
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- W2090901724 title "Abstract: Ion beam etching equipment for production of bubble memory devices" @default.
- W2090901724 doi "https://doi.org/10.1063/1.327034" @default.
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