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- W2090929129 abstract "A model system for investigating the formation of electromigration damage and the electromigration lifetime of thin film metallizations has been developed. This system contains fast diffusing segments consisting of plastically deformed regions created by nanoindentation in single-crystal pure Al conductor lines. These segments mimic the behavior of polygranular segments in lines having “near-bamboo” grain structure. We have used these model systems to investigate critical length effects and segment interaction effects, as well as the nucleation and evolution of electromigration voids as a function of orientation. Void nucleation is shown to depend on segment length and current density and segments are shown to interact to nucleate electromigration damage. Electromigration void evolution and electromigration lifetimes are shown to depend strongly on the crystallographic orientation of the conductor lines." @default.
- W2090929129 created "2016-06-24" @default.
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- W2090929129 date "1999-01-01" @default.
- W2090929129 modified "2023-09-27" @default.
- W2090929129 title "Model studies of electromigration using indented single-crystal aluminum lines" @default.
- W2090929129 cites W1522958773 @default.
- W2090929129 doi "https://doi.org/10.1063/1.59899" @default.
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