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- W2091181271 abstract "The packaging of microelectromechanical devices is currently one of the most challenging in this emerging field. The available packaging technologies often provide large dimensions and expensive solutions, thereby limiting the market penetration of micro electromechanical devices. A wafer level chip scale package (WLCSP) with an integrated cavity above the active area of the device for microelectromechanical components is described. This WLCSP is designed for devices with mechanically moving components such as micromirrors, miniature gyroscopes, acceleration detectors, etc." @default.
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- W2091181271 date "2001-09-28" @default.
- W2091181271 modified "2023-09-27" @default.
- W2091181271 title "<title>Integrated cavity wafer level chip size package for MEMS applications</title>" @default.
- W2091181271 doi "https://doi.org/10.1117/12.442942" @default.
- W2091181271 hasPublicationYear "2001" @default.
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