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- W2091219796 abstract "Hydrogen incorporation during wet-chemical etching into p-type silicon was studied by CV measurements. Etching rates between 0.08 and 0.5 μm/s were generated by different ratios of HF:HNO3:CH3COOH solutions. CV measurements could be performed as fast as 9 min after etching. The CV profiles monitor the formation of electrically neutral boron–hydrogen complexes and provide direct evidence for the hydrogen penetration. We calculate the boron–hydrogen profiles within a simple model of trap-limited diffusion. During etching, a stationary free hydrogen profile is created in the sample. After etching, the free hydrogen diffuses deeper into the sample until all hydrogen is trapped by boron. In low-doped samples more than 60 min are needed to equilibrate the boron profile. A diffusion constant of DH=2.7×10−10 cm2/s is determined for the room temperature diffusion of positively charged hydrogen. The value is in agreement with an extrapolation of the known diffusion data. According to our model the diffusion constant is identical during and after etching. No enhanced diffusion during etching is detected as was frequently reported." @default.
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- W2091219796 date "2003-04-01" @default.
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- W2091219796 title "Hydrogen penetration into silicon during wet-chemical etching" @default.
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- W2091219796 doi "https://doi.org/10.1016/s0167-9317(02)00926-7" @default.
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