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- W2091259281 abstract "The electrodeposition of gold is a key technology in the fabrication of many microelectronic, optoelectronic and microsystem devices. In this review, we examine some recent applications, and consider the suitability of various gold plating systems for device fabrication. The properties of gold cyanide and sulfite baths and their limitations are considered first. This is followed by an analysis of the latest generation of non-cyanide baths, including the thiosulfate, sulfite-thiosulfate and ammonium gold systems. Plating baths containing mercaptoalkylsulfonic acid and hydantoin ligands are also briefly discussed. Finally an analysis of the stability of gold plating baths is presented." @default.
- W2091259281 created "2016-06-24" @default.
- W2091259281 creator A5001313560 @default.
- W2091259281 date "2007-06-01" @default.
- W2091259281 modified "2023-10-01" @default.
- W2091259281 title "Gold electrodeposition for microelectronic, optoelectronic and microsystem applications" @default.
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- W2091259281 doi "https://doi.org/10.1007/bf03215566" @default.
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