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- W2091374150 abstract "This paper investigates friction and wear mechanisms of copper electrochemical mechanical polishing (ECMP) in pH and potential parameters as illustrated in the Pourbaix diagram. Three approaches were used in this study. First, a unique experimental setup was designed to investigate the effects of pH and electropotential on planarization. Second, the friction was measured in situ during polishing and used as a monitoring process. Third, the worn areas correlated with the frictional behavior of post-chemical mechanical polishing samples were characterized to study ECMP removal mechanisms. Results showed that friction maps can be generated in conjunction with the equilibrium Pourbaix diagram. This map is helpful in monitoring the removal rate and wear during copper ECMP. These findings can be used as guidance in ECMP process design and optimization." @default.
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- W2091374150 date "2008-01-01" @default.
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- W2091374150 title "Friction and Wear-Mode Comparison in Copper Electrochemical Mechanical Polishing" @default.
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- W2091374150 doi "https://doi.org/10.1149/1.2917907" @default.
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