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- W2092014627 abstract "The effects of some additive chemicals on the deposition of copper by chemical vapor deposition with Cu(hfac)tmvs have been investigated. Diethylamine and acetaldehyde had no effect on copper film deposition. Use of triethylsilanol slightly increased the deposition rate, with a maximum at the molecular triethylsilanol/Cu(hfac)tmvs ratio of 0.4%. Water and formic acid markedly increased the deposition rate and the number of reactions per molecule of these additives was determined to be more than one, implying that they act as catalysts. The effects of water and formic acid on copper films purity have also been investigated." @default.
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- W2092014627 date "2002-08-15" @default.
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- W2092014627 title "Addition of Chemicals for Deposition of Copper by Chemical Vapor Deposition Using Cu(hfac)tmvs Precursor" @default.
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- W2092014627 doi "https://doi.org/10.1143/jjap.41.l903" @default.
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