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• W2092193044 endingPage "7081" @default.
• W2092193044 startingPage "7076" @default.
• W2092193044 abstract "As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm2, a highly corrosive microenvironment can form at the solder surface, with pH < 2.5 and chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated." @default.
• W2092193044 created "2016-06-24" @default.
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• W2092193044 creator A5037059104 @default.
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• W2092193044 date "2010-08-25" @default.
• W2092193044 modified "2023-09-26" @default.
• W2092193044 title "Corrosive Microenvironments at Lead Solder Surfaces Arising from Galvanic Corrosion with Copper Pipe" @default.
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• W2092193044 doi "https://doi.org/10.1021/es1015185" @default.
• W2092193044 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/20738129" @default.
• W2092193044 hasPublicationYear "2010" @default.
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