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• W2092304832 abstract "Stacking of silicon chips with carbon nanotube (CNT)-based through-silicon vias (TSVs) is experimentally demonstrated. Polymer filling is used to improve the transfer quality of CNTs into pre-etched silicon holes. Special hexagonal CNTs are designed to achieve high aspect ratio (10:1) CNT vias. TSVs filled with closely packed CNTs show a highly linear dc I-V response. The proposed process works at room temperature, which makes it compatible with existing device fabrication flow." @default.
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• W2092304832 date "2015-05-01" @default.
• W2092304832 modified "2023-09-26" @default.
• W2092304832 title "Vertically Stacked Carbon Nanotube-Based Interconnects for Through Silicon Via Application" @default.
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• W2092304832 doi "https://doi.org/10.1109/led.2015.2415198" @default.
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