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- W2092671593 abstract "In this paper, a low temperature hermetic wafer level packaging scheme for the RFMEMS devices is presented. For hermetic sealing, Au-Sn multilayer metallization with a square loop of 70 %m in width is performed. The size of the MEMS package is 1mm × 1mm × 700 %m. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. The total insertion loss for the packaging is 0.075 dB at 2 GHz." @default.
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- W2092671593 date "2006-12-01" @default.
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- W2092671593 title "Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding" @default.
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- W2092671593 doi "https://doi.org/10.4028/www.scientific.net/kem.326-328.609" @default.
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