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- W2092892722 abstract "Solder bumps are important interconnect components for 3D integration. Their mechanical and electrical properties influence the overall reliability of 3D ICs. A characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation influences the operation of 3D ICs and, in connection with electro-migration, may cause failures in ICs. In this paper we present a model for describing the growth of intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on the new model are discussed in conjunction with corresponding experimental findings." @default.
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- W2092892722 date "2013-09-01" @default.
- W2092892722 modified "2023-09-23" @default.
- W2092892722 title "Impact of intermetallic compound on solder bump electromigration reliability" @default.
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- W2092892722 doi "https://doi.org/10.1109/sispad.2013.6650577" @default.
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