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- W2093205852 abstract "Abstract A nanocrystalline Cu–Sn alloy film was processed by electroplating, and the indentation tests and microstructural observation were conducted on the electroplated Cu–Sn alloy film. The indentation tests at room temperature showed that a large amount of strain was recovered on unloading for the electroplated Cu–Sn alloy film, in contract, such a large reversible strain was not found in an electroplated pure Cu film. Thus, the electroplated Cu–Sn alloy film exhibited superelastic behavior. The grain size of the Cu–Sn alloy film was 99 nm. In spite of the very small grain size, the austenite start and finish temperatures of the Cu–Sn alloy film were relatively high. This is suggested to be related to the presence of the α-Cu phase." @default.
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- W2093205852 date "2008-11-01" @default.
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- W2093205852 title "A superelastic nanocrystalline Cu–Sn alloy thin film processed by electroplating" @default.
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- W2093205852 doi "https://doi.org/10.1016/j.matlet.2008.08.008" @default.
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