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• W2093875481 abstract "This paper presents signal integrity analysis of a high-performance processor package with silicon interposer. Thediewas attached on the top side of the siliconinterposer with through silicon vias (TSVs), and theinterposer was connected to the organic substrate. The signal transmission path of this package consists of two redistribution layers (RDLs), TSVson interposer, and wirings on the substrate. The detailed signal integrity analysis with 3D full-wave electromagnetic method and equivalent circuit method are presented to verify the signaltransmission characteristics of the system. The co-simulation of this 2.5D package including silicon interposer and organic substrate is also presented in this paper." @default.
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• W2093875481 date "2014-05-01" @default.
• W2093875481 modified "2023-09-22" @default.
• W2093875481 title "Signal integrity analysis of a high-performance processor package with silicon interposer" @default.
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• W2093875481 doi "https://doi.org/10.1109/icept.2014.6922777" @default.
• W2093875481 hasPublicationYear "2014" @default.
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