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- W2094251799 abstract "Three-dimensional (3D) through-silicon-via (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous devices. TSVs provide high speed signal propagation due to reduced interconnect lengths as compared to wire-bonding. The current flowing through the TSVs results in localized heat generation (joule heating), which could be detrimental to the device performance. The effect of joule heating on performance measured by transconductance, electron mobility (e− mobility), and channel thermal noise is presented. Results indicate that joule heating has a significant effect on the junction temperature and subsequently results in 10–15% performance hit." @default.
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- W2094251799 date "2014-09-19" @default.
- W2094251799 modified "2023-10-12" @default.
- W2094251799 title "Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications" @default.
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- W2094251799 doi "https://doi.org/10.1115/1.4028076" @default.
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