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- W2094409888 abstract "Electromigration (EM) tests on Cu thin film circuits below or near 373 K with the current density between 1 x 10 9 A/m 2 and 8 × 10 9 A/m 2 were carried out by means of the composite vibrating reed method. The resonant frequency (f) and the internal friction (Q -1 ) of the composite reed and the resistivity (R) of the thin film circuit were measured during isothermal EM tests for as deposited Cu/Ta films, Cu/Ta films annealed at 450 K and as deposited Ta/Cu/Ta films. An increase in f, a decrease in Q -1 and a decrease in R were commonly observed. The activation energies found for the EM process (E EM ) range between 0.21 and 0.41 eV for the as deposited Cu/Ta films, between 0.21 and 0.59 eV for the annealed Cu/Ta films and around 0.3 eV for as deposited Ta/Cu/Ta films. It is suggested that a previously unrecognized mass transport process with low E EM operates in these Cu thin films." @default.
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- W2094409888 date "2006-12-01" @default.
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- W2094409888 title "Anelasticity study on electromigration effect in Cu thin films" @default.
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- W2094409888 doi "https://doi.org/10.1016/j.msea.2006.02.227" @default.
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