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• W2094986881 abstract "The thermal evolution of organic light emitting device structures and materials has been measured using X-ray specular reflectivity. Thermally induced failure of these structures is found to be due to the large thermal expansion of the hole transport layer (N,N′-diphenyl-N,N′-bis(3-methylphenyl)1,1′-biphenyl-4,4′diamine, or TPD) associated with its low glass transition temperature, suggesting a strain-driven failure mechanism (as opposed to TPD recrystallization). These results suggest the possibility of optimizing organic light emitting devices through direct in-situ measurements of their structure and stability." @default.
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• W2094986881 date "1997-10-01" @default.
• W2094986881 modified "2023-10-18" @default.
• W2094986881 title "Thermally induced failure mechanisms of organic light emitting device structures probed by X-ray specular reflectivity" @default.
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• W2094986881 doi "https://doi.org/10.1016/s0009-2614(97)00941-x" @default.
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