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- W2095927861 abstract "In this paper, a contribution to development of three-dimensional (3-D) techniques using multilayer boards for design of passive circuit components is presented. Shown approach gives a possibility to obtain compact devices with an improved EMI performance. A distinguishing point of this approach is a shield via structure which serves as both a vertical transmission line and an appropriate element of a passive such as short- or open-circuited stub, as for an example. Here bandpass and bandstop filters designed by the use of stub elements obtained as a part of the shield via structure are demonstrated. Simulation and measurement data obtained for the filters demonstrate a high performance of such components and a perspective direction in development of compact and cost-effective devices." @default.
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- W2095927861 date "2008-10-01" @default.
- W2095927861 modified "2023-09-22" @default.
- W2095927861 title "New 3-D Design of Filtering Components Using Multilayer Board Technologies" @default.
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- W2095927861 doi "https://doi.org/10.1109/eumc.2008.4751427" @default.
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