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- W2096471445 abstract "To save layout area for electrostatic discharge (ESD) protection design in the SOC era, test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35 /spl mu/m one-poly-four-metal (1P4M) 3.3V CMOS process for verification. The bond pads had been drawn with different layout patterns on the inter-layer metals to investigate the effect of bonding stress on the active devices under the pads. Threshold voltage, off-state drain current, and gate leakage current of these devices under bond pads have been measured. After assembled in wire bond package, the measurement results show that there are only little variations between devices under bond pads and devices beside bond pads. This result can be applied on saving layout area for on-chip ESD protection devices or I/O devices of IC products, especially for the high-pin-count system-on-a-chip (SOC)." @default.
- W2096471445 created "2016-06-24" @default.
- W2096471445 creator A5015289022 @default.
- W2096471445 creator A5021821095 @default.
- W2096471445 creator A5043540734 @default.
- W2096471445 date "2004-03-22" @default.
- W2096471445 modified "2023-09-27" @default.
- W2096471445 title "Active device under bond pad to save I/O layout for high-pin-count SOC" @default.
- W2096471445 cites W1507469170 @default.
- W2096471445 cites W2105011709 @default.
- W2096471445 cites W2144424846 @default.
- W2096471445 cites W2153934494 @default.
- W2096471445 cites W2153974920 @default.
- W2096471445 doi "https://doi.org/10.1109/isqed.2003.1194738" @default.
- W2096471445 hasPublicationYear "2004" @default.
- W2096471445 type Work @default.
- W2096471445 sameAs 2096471445 @default.
- W2096471445 citedByCount "2" @default.
- W2096471445 countsByYear W20964714452015 @default.
- W2096471445 crossrefType "proceedings-article" @default.
- W2096471445 hasAuthorship W2096471445A5015289022 @default.
- W2096471445 hasAuthorship W2096471445A5021821095 @default.
- W2096471445 hasAuthorship W2096471445A5043540734 @default.
- W2096471445 hasConcept C111106434 @default.
- W2096471445 hasConcept C119599485 @default.
- W2096471445 hasConcept C127413603 @default.
- W2096471445 hasConcept C140269135 @default.
- W2096471445 hasConcept C165005293 @default.
- W2096471445 hasConcept C165801399 @default.
- W2096471445 hasConcept C171250308 @default.
- W2096471445 hasConcept C172385210 @default.
- W2096471445 hasConcept C192562407 @default.
- W2096471445 hasConcept C197162436 @default.
- W2096471445 hasConcept C205483674 @default.
- W2096471445 hasConcept C46362747 @default.
- W2096471445 hasConcept C49040817 @default.
- W2096471445 hasConceptScore W2096471445C111106434 @default.
- W2096471445 hasConceptScore W2096471445C119599485 @default.
- W2096471445 hasConceptScore W2096471445C127413603 @default.
- W2096471445 hasConceptScore W2096471445C140269135 @default.
- W2096471445 hasConceptScore W2096471445C165005293 @default.
- W2096471445 hasConceptScore W2096471445C165801399 @default.
- W2096471445 hasConceptScore W2096471445C171250308 @default.
- W2096471445 hasConceptScore W2096471445C172385210 @default.
- W2096471445 hasConceptScore W2096471445C192562407 @default.
- W2096471445 hasConceptScore W2096471445C197162436 @default.
- W2096471445 hasConceptScore W2096471445C205483674 @default.
- W2096471445 hasConceptScore W2096471445C46362747 @default.
- W2096471445 hasConceptScore W2096471445C49040817 @default.
- W2096471445 hasLocation W20964714451 @default.
- W2096471445 hasOpenAccess W2096471445 @default.
- W2096471445 hasPrimaryLocation W20964714451 @default.
- W2096471445 hasRelatedWork W1591958175 @default.
- W2096471445 hasRelatedWork W1849152305 @default.
- W2096471445 hasRelatedWork W1967899474 @default.
- W2096471445 hasRelatedWork W1973496633 @default.
- W2096471445 hasRelatedWork W1983340962 @default.
- W2096471445 hasRelatedWork W2063549352 @default.
- W2096471445 hasRelatedWork W2085914380 @default.
- W2096471445 hasRelatedWork W2099486241 @default.
- W2096471445 hasRelatedWork W2101743400 @default.
- W2096471445 hasRelatedWork W2116106099 @default.
- W2096471445 hasRelatedWork W2142491971 @default.
- W2096471445 hasRelatedWork W2143408028 @default.
- W2096471445 hasRelatedWork W2160980550 @default.
- W2096471445 hasRelatedWork W2289685480 @default.
- W2096471445 hasRelatedWork W2953181268 @default.
- W2096471445 hasRelatedWork W302154069 @default.
- W2096471445 hasRelatedWork W2470916372 @default.
- W2096471445 hasRelatedWork W2826098066 @default.
- W2096471445 hasRelatedWork W2846944180 @default.
- W2096471445 hasRelatedWork W2847085973 @default.
- W2096471445 isParatext "false" @default.
- W2096471445 isRetracted "false" @default.
- W2096471445 magId "2096471445" @default.
- W2096471445 workType "article" @default.