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• W2096489898 abstract "As the demands for high-density, high-speed, high-performance, and multi-function in portable electronic products, packaging technologies require significant improvement to bring out ICs' performance and shrink the total module or package size. One representative technology is to embed active devices into an organic substrate by sequential build-up processes, for example, chip-in-polymer by IZM, bumpless build-up layer by Intel, and chip-in-substrate package (CiSP) by EOL/ITRI. Through embedding the semiconductor chip in the organic substrate, the package with very good electrical performance and good capability for system integration can be realized. In this research, DDRII memory was chosen as the CiSP test vehicle, and the designed structure provides better electrical and thermal performance. Several core techniques, such as wafer thinning, die bonding, high-flatness lamination, were well developed to embed DDRII-like thin chips (50 /spl mu/m thick) into dielectric material on a carrier substrate. The PCB compatible laser drilling, via metallization, and patterning technologies were subsequently followed to form an electric path from chip-pad to outer, which provides shorter interconnection for the demand of fast electrical response application. Moreover, the vehicle was tested by lead-free reliability tests, inclusive of pre-condition (3 reflows at 260/spl deg/C), level B thermal cycle, and 168 hrs PCT tests. The newest results of the reliability tests will be presented in the paper." @default.
• W2096489898 created "2016-06-24" @default.
• W2096489898 creator A5008890426 @default.
• W2096489898 creator A5025518198 @default.
• W2096489898 creator A5036196633 @default.
• W2096489898 creator A5042151372 @default.
• W2096489898 creator A5053108401 @default.
• W2096489898 creator A5062539810 @default.
• W2096489898 date "2006-07-10" @default.
• W2096489898 modified "2023-09-26" @default.
• W2096489898 title "Embedded Active Device Packaging Technology for Next-Generation Chip-in-Substrate Package, CiSP" @default.
• W2096489898 cites W2101528075 @default.
• W2096489898 cites W2111041614 @default.
• W2096489898 cites W2112196304 @default.
• W2096489898 cites W2167176844 @default.
• W2096489898 cites W2537023997 @default.
• W2096489898 cites W3213228977 @default.
• W2096489898 doi "https://doi.org/10.1109/ectc.2006.1645666" @default.
• W2096489898 hasPublicationYear "2006" @default.
• W2096489898 type Work @default.
• W2096489898 sameAs 2096489898 @default.
• W2096489898 citedByCount "24" @default.
• W2096489898 countsByYear W20964898982012 @default.
• W2096489898 countsByYear W20964898982013 @default.
• W2096489898 countsByYear W20964898982014 @default.
• W2096489898 countsByYear W20964898982015 @default.
• W2096489898 countsByYear W20964898982016 @default.
• W2096489898 countsByYear W20964898982020 @default.
• W2096489898 crossrefType "proceedings-article" @default.
• W2096489898 hasAuthorship W2096489898A5008890426 @default.
• W2096489898 hasAuthorship W2096489898A5025518198 @default.
• W2096489898 hasAuthorship W2096489898A5036196633 @default.
• W2096489898 hasAuthorship W2096489898A5042151372 @default.
• W2096489898 hasAuthorship W2096489898A5053108401 @default.
• W2096489898 hasAuthorship W2096489898A5062539810 @default.
• W2096489898 hasConcept C111106434 @default.
• W2096489898 hasConcept C111368507 @default.
• W2096489898 hasConcept C119599485 @default.
• W2096489898 hasConcept C121332964 @default.
• W2096489898 hasConcept C123745756 @default.
• W2096489898 hasConcept C126233035 @default.
• W2096489898 hasConcept C127313418 @default.
• W2096489898 hasConcept C127413603 @default.
• W2096489898 hasConcept C160671074 @default.
• W2096489898 hasConcept C163258240 @default.
• W2096489898 hasConcept C165005293 @default.
• W2096489898 hasConcept C171250308 @default.
• W2096489898 hasConcept C186260285 @default.
• W2096489898 hasConcept C192562407 @default.
• W2096489898 hasConcept C193149544 @default.
• W2096489898 hasConcept C24326235 @default.
• W2096489898 hasConcept C2777289219 @default.
• W2096489898 hasConcept C2780288131 @default.
• W2096489898 hasConcept C41008148 @default.
• W2096489898 hasConcept C43214815 @default.
• W2096489898 hasConcept C49040817 @default.
• W2096489898 hasConcept C530198007 @default.
• W2096489898 hasConcept C59014099 @default.
• W2096489898 hasConcept C62520636 @default.
• W2096489898 hasConcept C76155785 @default.
• W2096489898 hasConcept C78519656 @default.
• W2096489898 hasConceptScore W2096489898C111106434 @default.
• W2096489898 hasConceptScore W2096489898C111368507 @default.
• W2096489898 hasConceptScore W2096489898C119599485 @default.
• W2096489898 hasConceptScore W2096489898C121332964 @default.
• W2096489898 hasConceptScore W2096489898C123745756 @default.
• W2096489898 hasConceptScore W2096489898C126233035 @default.
• W2096489898 hasConceptScore W2096489898C127313418 @default.
• W2096489898 hasConceptScore W2096489898C127413603 @default.
• W2096489898 hasConceptScore W2096489898C160671074 @default.
• W2096489898 hasConceptScore W2096489898C163258240 @default.
• W2096489898 hasConceptScore W2096489898C165005293 @default.
• W2096489898 hasConceptScore W2096489898C171250308 @default.
• W2096489898 hasConceptScore W2096489898C186260285 @default.
• W2096489898 hasConceptScore W2096489898C192562407 @default.
• W2096489898 hasConceptScore W2096489898C193149544 @default.
• W2096489898 hasConceptScore W2096489898C24326235 @default.
• W2096489898 hasConceptScore W2096489898C2777289219 @default.
• W2096489898 hasConceptScore W2096489898C2780288131 @default.
• W2096489898 hasConceptScore W2096489898C41008148 @default.
• W2096489898 hasConceptScore W2096489898C43214815 @default.
• W2096489898 hasConceptScore W2096489898C49040817 @default.
• W2096489898 hasConceptScore W2096489898C530198007 @default.
• W2096489898 hasConceptScore W2096489898C59014099 @default.
• W2096489898 hasConceptScore W2096489898C62520636 @default.
• W2096489898 hasConceptScore W2096489898C76155785 @default.
• W2096489898 hasConceptScore W2096489898C78519656 @default.
• W2096489898 hasLocation W20964898981 @default.
• W2096489898 hasOpenAccess W2096489898 @default.
• W2096489898 hasPrimaryLocation W20964898981 @default.
• W2096489898 hasRelatedWork W1965560269 @default.
• W2096489898 hasRelatedWork W1996090865 @default.
• W2096489898 hasRelatedWork W2012595766 @default.
• W2096489898 hasRelatedWork W2058032318 @default.
• W2096489898 hasRelatedWork W2112196304 @default.
• W2096489898 hasRelatedWork W2131739070 @default.
• W2096489898 hasRelatedWork W2132738978 @default.
• W2096489898 hasRelatedWork W2133679916 @default.
• W2096489898 hasRelatedWork W2144114410 @default.
• W2096489898 hasRelatedWork W2146653167 @default.

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