Matches in SemOpenAlex for { <https://semopenalex.org/work/W2097323275> ?p ?o ?g. }
Showing items 1 to 92 of
92
with 100 items per page.
- W2097323275 abstract "The reliability of RF PA module substrate vias was evaluated using nine different laminate constructions. Variables in the substrate construction included layer count, trace thickness, via wall thickness, via diameter, via plugging, via capping, core material, and process flow at the supplier. A daisy chain module was designed to simulate a typical over molded RF PA module. The body size was 10/spl times/10 mm, with 2 die, 20 components, and 34 LGA I/O pads. Daisy chain nets were formed through 2 via chains, and 1 SMD component chain. Via reliability was measured by temperature cycling at -55/spl deg/C 125/spl deg/C, 2 cph, after pre-conditioning at Jedec L3/240/spl deg/C and L3/260/spl deg/C. Both package level and board level testing was conducted. In the package level tests, it was found that nearly all of the constructions passed the typical qualification requirement of 1000 temperature cycles. However, one construction had failures starting at 600 cycles due to cracks in the knee region of the substrate vias. This construction used a less robust manufacturing flow at the substrate supplier. Three of the nine constructions were evaluated in the board level tests. All three legs passed the 1000 temperature cycle requirement, with the first via failure observed at 1372 cycles. No 2nd level solder joint failures were observed before the test was terminated at 3779 cycles. This robust board level temperature cycling performance is due to large NSMD pads (0.8 mm/spl times/0.8 mm), and small die (1.0 mm/spl times/1.0 mm). Failure analysis was conducted on all test legs to understand crack initiation sites and crack growth paths in the substrate vias." @default.
- W2097323275 created "2016-06-24" @default.
- W2097323275 creator A5013045488 @default.
- W2097323275 creator A5014478227 @default.
- W2097323275 creator A5018333988 @default.
- W2097323275 creator A5038762565 @default.
- W2097323275 creator A5058449094 @default.
- W2097323275 creator A5079102951 @default.
- W2097323275 date "2004-05-06" @default.
- W2097323275 modified "2023-09-26" @default.
- W2097323275 title "Board level reliability evaluation of RF PA module vias" @default.
- W2097323275 cites W1622717997 @default.
- W2097323275 cites W2112851013 @default.
- W2097323275 cites W2125705894 @default.
- W2097323275 doi "https://doi.org/10.1109/iemt.2003.1225918" @default.
- W2097323275 hasPublicationYear "2004" @default.
- W2097323275 type Work @default.
- W2097323275 sameAs 2097323275 @default.
- W2097323275 citedByCount "1" @default.
- W2097323275 countsByYear W20973232752020 @default.
- W2097323275 crossrefType "proceedings-article" @default.
- W2097323275 hasAuthorship W2097323275A5013045488 @default.
- W2097323275 hasAuthorship W2097323275A5014478227 @default.
- W2097323275 hasAuthorship W2097323275A5018333988 @default.
- W2097323275 hasAuthorship W2097323275A5038762565 @default.
- W2097323275 hasAuthorship W2097323275A5058449094 @default.
- W2097323275 hasAuthorship W2097323275A5079102951 @default.
- W2097323275 hasConcept C111106434 @default.
- W2097323275 hasConcept C111368507 @default.
- W2097323275 hasConcept C119599485 @default.
- W2097323275 hasConcept C120793396 @default.
- W2097323275 hasConcept C121332964 @default.
- W2097323275 hasConcept C127313418 @default.
- W2097323275 hasConcept C127413603 @default.
- W2097323275 hasConcept C153294291 @default.
- W2097323275 hasConcept C159985019 @default.
- W2097323275 hasConcept C163258240 @default.
- W2097323275 hasConcept C171250308 @default.
- W2097323275 hasConcept C177564732 @default.
- W2097323275 hasConcept C192562407 @default.
- W2097323275 hasConcept C204530211 @default.
- W2097323275 hasConcept C2777289219 @default.
- W2097323275 hasConcept C43214815 @default.
- W2097323275 hasConcept C50296614 @default.
- W2097323275 hasConcept C59014099 @default.
- W2097323275 hasConcept C62520636 @default.
- W2097323275 hasConceptScore W2097323275C111106434 @default.
- W2097323275 hasConceptScore W2097323275C111368507 @default.
- W2097323275 hasConceptScore W2097323275C119599485 @default.
- W2097323275 hasConceptScore W2097323275C120793396 @default.
- W2097323275 hasConceptScore W2097323275C121332964 @default.
- W2097323275 hasConceptScore W2097323275C127313418 @default.
- W2097323275 hasConceptScore W2097323275C127413603 @default.
- W2097323275 hasConceptScore W2097323275C153294291 @default.
- W2097323275 hasConceptScore W2097323275C159985019 @default.
- W2097323275 hasConceptScore W2097323275C163258240 @default.
- W2097323275 hasConceptScore W2097323275C171250308 @default.
- W2097323275 hasConceptScore W2097323275C177564732 @default.
- W2097323275 hasConceptScore W2097323275C192562407 @default.
- W2097323275 hasConceptScore W2097323275C204530211 @default.
- W2097323275 hasConceptScore W2097323275C2777289219 @default.
- W2097323275 hasConceptScore W2097323275C43214815 @default.
- W2097323275 hasConceptScore W2097323275C50296614 @default.
- W2097323275 hasConceptScore W2097323275C59014099 @default.
- W2097323275 hasConceptScore W2097323275C62520636 @default.
- W2097323275 hasLocation W20973232751 @default.
- W2097323275 hasOpenAccess W2097323275 @default.
- W2097323275 hasPrimaryLocation W20973232751 @default.
- W2097323275 hasRelatedWork W1581886860 @default.
- W2097323275 hasRelatedWork W1983340962 @default.
- W2097323275 hasRelatedWork W1988778418 @default.
- W2097323275 hasRelatedWork W1994397769 @default.
- W2097323275 hasRelatedWork W2002281837 @default.
- W2097323275 hasRelatedWork W2021952043 @default.
- W2097323275 hasRelatedWork W2127832173 @default.
- W2097323275 hasRelatedWork W2149237593 @default.
- W2097323275 hasRelatedWork W2151577334 @default.
- W2097323275 hasRelatedWork W2160919069 @default.
- W2097323275 hasRelatedWork W2161230239 @default.
- W2097323275 hasRelatedWork W2168174036 @default.
- W2097323275 hasRelatedWork W2523686431 @default.
- W2097323275 hasRelatedWork W2607504375 @default.
- W2097323275 hasRelatedWork W2744653380 @default.
- W2097323275 hasRelatedWork W2744883906 @default.
- W2097323275 hasRelatedWork W2787794225 @default.
- W2097323275 hasRelatedWork W2886337169 @default.
- W2097323275 hasRelatedWork W2970042482 @default.
- W2097323275 hasRelatedWork W2962066809 @default.
- W2097323275 isParatext "false" @default.
- W2097323275 isRetracted "false" @default.
- W2097323275 magId "2097323275" @default.
- W2097323275 workType "article" @default.