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- W2097473397 abstract "ext-generation electronic packaging must be consistent with both semiconductors and systems. The packages of the past have been mostly passive containers for semiconductors. Given the need for extremely compact, ultra-low-cost electronic systems for the 21st century, and given that a wafer fabrication plant can cost $1 to $5 billion, what should packaging be in the future? Any packaging technology should also be built upon a knowledge of state-of-the-art packaging. This article proposes highly integrated and low-cost packaging that can improve performance and reduce cost and size by about a factor of 10. It also presents an overview of the next generation in electronic packaging education, called “globally competitive education.”" @default.
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- W2097473397 title "Electronic Packaging Research and Education: A Model for the 21st Century" @default.
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