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- W2097667035 abstract "Motorola Radio Products Division (RPD) bas recently introduced a series of Power Amplifier RF integrated modules, designed to support the Company’s Low Cost Architecture (LCA) chipsets, which allow customers to achieve a high level of RF functionality while minimizing board real estate. During the manufacturing implementation phase for two versions of enhanced PA modules in this series (the MMM6010 and MMM6011), a nomber of assembly issues related to the solder-attach process for this product’s MOScap SMT components were identified. These MOScaps are key to electrical performance and their effectiveness is related to control of their assembly to the board. The postreflow solder joints showed high levels of voiding, while the MOScap components themselves were prone to severe tilt, as a result of their relatively low mass and small form factor. Post-SMT wire bonding of these components proved difficult, and wire bond equipment MTBA was negatively impacted. Because of such issues, the possibility of using a thermally and electrically conductive epoxy adhesive in lieu of the solder was explored. It was found that the implementation of the epoxy die attach process for the MOScap components significantly improved bond line control, while virtually eliminating voiding and die tilt. Similarly, device RF performance and reliability were found to be equal to or better than that observed using the solder attach process. This paper documents the issues related to the solder attach process for MOScap devices in this RF PA module, and details the switch from solder to epoxy attach, including a discussion of the relative merit for device reliability and performance, as well as assembly throughput, both before and after implementation of the epoxy process." @default.
- W2097667035 created "2016-06-24" @default.
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- W2097667035 date "2004-06-22" @default.
- W2097667035 modified "2023-09-26" @default.
- W2097667035 title "Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT components" @default.
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- W2097667035 doi "https://doi.org/10.1109/ectc.2003.1216478" @default.
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