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• W2097941307 abstract "An Au-Si eutectic wafer-level bonding process was developed for low-temperature vacuum packaging of MEMS devices. Using Au-Si eutectic bonding, devices were encapsulated by bonding a silicon cap wafer to a device wafer. Micromachined Pirani vacuum sensors were encapsulated in order to characterize the packaged pressures. These packages had cavity dimensions of 2.3×2.3 mm with a depth of 90 µm. Yields of 84.6% and 94.1% were achieved in packages with bond ring widths of 100 and 150 µm. With the use of getters and a pre-bond outgassing step, pressures from ≪3.7 to 23.3 mTorr were achieved. Furthermore, pressures were shown to remain stable to within ±2.5 mTorr for over 4 years of testing." @default.
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• W2097941307 date "2009-06-01" @default.
• W2097941307 modified "2023-09-23" @default.
• W2097941307 title "A detailed study of yield and reliability for vacuum packages fabricated in a wafer-level Au-Si eutectic bonding process" @default.
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• W2097941307 doi "https://doi.org/10.1109/sensor.2009.5285779" @default.
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