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- W2098204889 abstract "Two thermal conductance techniques for detecting air contamination in a helium-filled thermal conduction module (TCM) used to package silicon chips are described. A silicon majority carrier thermistor was used to detect as little as 15% air contamination in a container filled with helium. The technique directly measured the internal cooling ability of the package. Both a static test and a transient test were developed. The transient test is shown to be independent of the thermistor packaging. The technique did not require any modification to a TCM. Most importantly, the technique directly measured the cooling ability of the fill gas. The measurement could be performed simply and routinely after assembly, or on return from the field.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
- W2098204889 created "2016-06-24" @default.
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- W2098204889 date "1991-03-01" @default.
- W2098204889 modified "2023-10-09" @default.
- W2098204889 title "Detection of air in helium filled thermal conduction modules" @default.
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- W2098204889 doi "https://doi.org/10.1109/33.76534" @default.
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