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• W2099225917 abstract "DC-magnetron sputtering silicon along with a post deposition annealing treatment is described as an alternative to LPCVD polysilicon which is commonly used as a structural material for surface micromachined devices. The sputtered silicon shows a small residual stress (compressive strain: less than 5.6/spl times/10/sup -5/) and a very smooth surface (average roughness: 25 /spl Aring/) which is inherently difficult to achieve with the LPCVD method. No need for pyrophoric silane and higher deposition rates are additional advantages over the conventional method." @default.
• W2099225917 created "2016-06-24" @default.
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• W2099225917 date "2002-12-23" @default.
• W2099225917 modified "2023-10-01" @default.
• W2099225917 title "Low strain sputtered polysilicon for micromechanical structures" @default.
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• W2099225917 doi "https://doi.org/10.1109/memsys.1996.493990" @default.
• W2099225917 hasPublicationYear "2002" @default.
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