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- W2099911232 abstract "IBM has developed various technologies for repairing defects in thin film circuitry, primarily for Multichip Module (MCM) applications. This paper discusses five technologies: laser chemical vapor deposition (LCVD), wire bond, laser-sonic bonding, solder repair, and self-induced repair, with focus on the process parameters and tooling aspects of the three established in IBM's production environment.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W2099911232 title "Open repair technologies for MCM-D" @default.
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- W2099911232 doi "https://doi.org/10.1109/96.365502" @default.
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