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- W2100026325 abstract "In this paper we report a technology for lightweight, small radio-frequency (rf) microelectromechanical system packaging with a short electrical path length. We used an ultrathin silicon substrate as the packaging substrate. Via holes for vertical feed-through were fabricated on the thin silicon wafer. Then, bottom-up gold electroplating was applied to fill via holes. For hermetic sealing, gold-gold direct metal bonding was used in the sealing line. The packaged rf device has a reflection loss below and an insertion loss of . Therefore, with the ultrathin silicon wafer, a lightweight, small device package can be constructed." @default.
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- W2100026325 date "2006-02-01" @default.
- W2100026325 modified "2023-10-16" @default.
- W2100026325 title "Ultrathin Silicon Micropackaging for RF MEMS Devices" @default.
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- W2100026325 doi "https://doi.org/10.1149/1.2150166" @default.
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