Matches in SemOpenAlex for { <https://semopenalex.org/work/W2100063676> ?p ?o ?g. }
Showing items 1 to 84 of
84
with 100 items per page.
- W2100063676 abstract "Gold wire thermosonic bonding remains the primary means of electrically connecting the silicon chip to the outside world. To keep up with the increasing interconnect density required by the ever shrinking die and with the need for package compactness, both wire and wire bonder manufacturers have made many improvements in technology. If the miniaturization trend continues at the current rate, the physical and process limits will ultimately be reached. The other possible technologies such as gold wedge bonding, tape automated bonding (TAB), and flip-chip offer some potential attractive interconnection solutions. These techniques also have their own inherent disadvantages. Until such drawbacks are resolved, the capabilities of thermosonic bonding will continue to be pushed as far as possible. >" @default.
- W2100063676 created "2016-06-24" @default.
- W2100063676 creator A5010140584 @default.
- W2100063676 creator A5058375226 @default.
- W2100063676 creator A5088366336 @default.
- W2100063676 creator A5088467503 @default.
- W2100063676 date "2002-12-30" @default.
- W2100063676 modified "2023-09-27" @default.
- W2100063676 title "Wire bonding: Present and future trends" @default.
- W2100063676 cites W1836380466 @default.
- W2100063676 cites W1969041883 @default.
- W2100063676 cites W2020678575 @default.
- W2100063676 cites W2116248389 @default.
- W2100063676 cites W2136324688 @default.
- W2100063676 cites W2142635684 @default.
- W2100063676 cites W2154885913 @default.
- W2100063676 cites W2471638448 @default.
- W2100063676 cites W3113847452 @default.
- W2100063676 cites W2518836880 @default.
- W2100063676 doi "https://doi.org/10.1109/iemt.1993.398223" @default.
- W2100063676 hasPublicationYear "2002" @default.
- W2100063676 type Work @default.
- W2100063676 sameAs 2100063676 @default.
- W2100063676 citedByCount "7" @default.
- W2100063676 countsByYear W21000636762015 @default.
- W2100063676 countsByYear W21000636762018 @default.
- W2100063676 crossrefType "proceedings-article" @default.
- W2100063676 hasAuthorship W2100063676A5010140584 @default.
- W2100063676 hasAuthorship W2100063676A5058375226 @default.
- W2100063676 hasAuthorship W2100063676A5088366336 @default.
- W2100063676 hasAuthorship W2100063676A5088467503 @default.
- W2100063676 hasConcept C119599485 @default.
- W2100063676 hasConcept C123745756 @default.
- W2100063676 hasConcept C127413603 @default.
- W2100063676 hasConcept C140269135 @default.
- W2100063676 hasConcept C165005293 @default.
- W2100063676 hasConcept C171250308 @default.
- W2100063676 hasConcept C186260285 @default.
- W2100063676 hasConcept C192562407 @default.
- W2100063676 hasConcept C2779227376 @default.
- W2100063676 hasConcept C57528182 @default.
- W2100063676 hasConcept C68928338 @default.
- W2100063676 hasConcept C76155785 @default.
- W2100063676 hasConcept C79072407 @default.
- W2100063676 hasConceptScore W2100063676C119599485 @default.
- W2100063676 hasConceptScore W2100063676C123745756 @default.
- W2100063676 hasConceptScore W2100063676C127413603 @default.
- W2100063676 hasConceptScore W2100063676C140269135 @default.
- W2100063676 hasConceptScore W2100063676C165005293 @default.
- W2100063676 hasConceptScore W2100063676C171250308 @default.
- W2100063676 hasConceptScore W2100063676C186260285 @default.
- W2100063676 hasConceptScore W2100063676C192562407 @default.
- W2100063676 hasConceptScore W2100063676C2779227376 @default.
- W2100063676 hasConceptScore W2100063676C57528182 @default.
- W2100063676 hasConceptScore W2100063676C68928338 @default.
- W2100063676 hasConceptScore W2100063676C76155785 @default.
- W2100063676 hasConceptScore W2100063676C79072407 @default.
- W2100063676 hasLocation W21000636761 @default.
- W2100063676 hasOpenAccess W2100063676 @default.
- W2100063676 hasPrimaryLocation W21000636761 @default.
- W2100063676 hasRelatedWork W1499481832 @default.
- W2100063676 hasRelatedWork W1507159838 @default.
- W2100063676 hasRelatedWork W1921171734 @default.
- W2100063676 hasRelatedWork W1954898313 @default.
- W2100063676 hasRelatedWork W2045967104 @default.
- W2100063676 hasRelatedWork W2095664284 @default.
- W2100063676 hasRelatedWork W2112978391 @default.
- W2100063676 hasRelatedWork W2116248389 @default.
- W2100063676 hasRelatedWork W2166414894 @default.
- W2100063676 hasRelatedWork W2358501646 @default.
- W2100063676 hasRelatedWork W2367423046 @default.
- W2100063676 hasRelatedWork W2389440587 @default.
- W2100063676 hasRelatedWork W2390972729 @default.
- W2100063676 hasRelatedWork W2409089622 @default.
- W2100063676 hasRelatedWork W2429116315 @default.
- W2100063676 hasRelatedWork W2533734337 @default.
- W2100063676 hasRelatedWork W2904366442 @default.
- W2100063676 hasRelatedWork W2990458766 @default.
- W2100063676 hasRelatedWork W826000186 @default.
- W2100063676 hasRelatedWork W2090662636 @default.
- W2100063676 isParatext "false" @default.
- W2100063676 isRetracted "false" @default.
- W2100063676 magId "2100063676" @default.
- W2100063676 workType "article" @default.