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- W2100480030 abstract "초록: 전자기기부품에적용되는회로기판의패키지공정상에서가해지는온도변화에따른신뢰성평가시발생되는문제들은, 주로회로기판을구성하고있는기본재료들의열팽창계수차이및시간의존성물성에의해영향을받는다. 특히, 인쇄회로기판내부회로층사이에서절연역할을수행하는유리섬유강화복합재료와같은수지몰딩고분자재료는온도에따른물성변화뿐만아니라, 변형및하중이가해지는시간에대한물성변화도고려해야하는점탄성성질을나타낸다. 본논문에서는인쇄회로기판에사용되는주요고분자재료인유리섬유강화복합재의시간및온도에따른점탄성특성을규명하기위하여, 단축인장모드의응력완화시험과크리프시험을각각수행하였다. 또한, 고분자재료점탄성물성의영향성을파악하기위하여, 유한요소해석을이용한인쇄회로기판의예비가열공정상에서가해지는온도변화에따른열변형을평가하였다. 이러한해석결과를바탕으로, 인쇄회로기판과같이고분자재료를사용하는전자회로구조물의수치해석기반의열변형예측시점탄성물성의고려필요성을검증하였다.Abstract: The reliability problems of flip chip packages subjected to temperature change during the packaging processmainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependentmaterial properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer inprinted circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young’s moduli to not only betemperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used tocharacterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties,finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermalwarpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in thePCB (the glass fiber reinforced epoxy composite) was investigated using FEA." @default.
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- W2100480030 date "2010-02-01" @default.
- W2100480030 modified "2023-09-24" @default.
- W2100480030 title "Characterization for Viscoelasticity of Glass Fiber Reinforced Epoxy Composite and Application to Thermal Warpage Analysis in Printed Circuit Board" @default.
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- W2100480030 doi "https://doi.org/10.3795/ksme-a.2010.34.2.245" @default.
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