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- W2102313721 abstract "By comparing against in-house experimental measurements, this study evaluates the numerical simulations of hygro/thermo-mechanical deformations in polymer structures commonly used in electronic packages The simulations are achieved by using the finite element method (FEM). Two different material characterization techniques are utilized for displacements and/or strains due to both moisture and thermal loading." @default.
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- W2102313721 date "2004-09-28" @default.
- W2102313721 modified "2023-09-26" @default.
- W2102313721 title "Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures [IC packaging applications]" @default.
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- W2102313721 doi "https://doi.org/10.1109/ectc.2004.1319441" @default.
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