Matches in SemOpenAlex for { <https://semopenalex.org/work/W2102502904> ?p ?o ?g. }
Showing items 1 to 76 of
76
with 100 items per page.
- W2102502904 endingPage "236" @default.
- W2102502904 startingPage "229" @default.
- W2102502904 abstract "Abstract Waste printed circuit boards (PCBs) are the focal points for handling electric and electronic waste. In this paper, a thermal shock method was used to pretreat waste PCBs for the improvement of crushing performance. The influence of the thermal shock process on interfacial modification and mechanical property attenuation of PCB waste was studied. The appearance and layer spacing of the basal plane began to change slightly when the temperature reached 200 °C. By 250 °C, apparent bulging, cracking, and delamination were observed. However, pyrolysis of PCBs occurred when the temperature reached 275 °C, where PCBs were carbonized. The thermogravimetric analysis of PCB particles under vacuum showed that 270 °C was the starting point of pyrolysis. The tensile and impact strength of PCBs were reduced as shock temperature rose gradually, with a reduction by 2.6 and 16.5%, respectively, at 250 °C from its unheated strength. The PCBs that were heated to 250 °C achieved 100% liberation, increasing linearly from 13.6% for unheated PCBs through a single-level shear-crusher (2-mm mesh) and resulting in an obvious reduction of 9.5% (dB) in dust and noise at 250 °C. These parameters could be helpful for establishing the operational setup for industrial-scale facilities with the aim of achieving a compact process and a highly efficient recovery for waste PCBs compared with those of the traditional combination mechanical technologies." @default.
- W2102502904 created "2016-06-24" @default.
- W2102502904 creator A5004861529 @default.
- W2102502904 creator A5026274687 @default.
- W2102502904 creator A5039660676 @default.
- W2102502904 creator A5040844188 @default.
- W2102502904 date "2010-02-01" @default.
- W2102502904 modified "2023-09-27" @default.
- W2102502904 title "Interfacial and Mechanical Property Analysis of Waste Printed Circuit Boards Subject to Thermal Shock" @default.
- W2102502904 cites W2010028136 @default.
- W2102502904 cites W2096502015 @default.
- W2102502904 doi "https://doi.org/10.3155/1047-3289.60.2.229" @default.
- W2102502904 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/20222536" @default.
- W2102502904 hasPublicationYear "2010" @default.
- W2102502904 type Work @default.
- W2102502904 sameAs 2102502904 @default.
- W2102502904 citedByCount "18" @default.
- W2102502904 countsByYear W21025029042014 @default.
- W2102502904 countsByYear W21025029042016 @default.
- W2102502904 countsByYear W21025029042017 @default.
- W2102502904 countsByYear W21025029042018 @default.
- W2102502904 countsByYear W21025029042019 @default.
- W2102502904 countsByYear W21025029042021 @default.
- W2102502904 countsByYear W21025029042022 @default.
- W2102502904 countsByYear W21025029042023 @default.
- W2102502904 crossrefType "journal-article" @default.
- W2102502904 hasAuthorship W2102502904A5004861529 @default.
- W2102502904 hasAuthorship W2102502904A5026274687 @default.
- W2102502904 hasAuthorship W2102502904A5039660676 @default.
- W2102502904 hasAuthorship W2102502904A5040844188 @default.
- W2102502904 hasConcept C112950240 @default.
- W2102502904 hasConcept C119599485 @default.
- W2102502904 hasConcept C120793396 @default.
- W2102502904 hasConcept C127413603 @default.
- W2102502904 hasConcept C159985019 @default.
- W2102502904 hasConcept C176177977 @default.
- W2102502904 hasConcept C192562407 @default.
- W2102502904 hasConcept C2777899904 @default.
- W2102502904 hasConcept C36759035 @default.
- W2102502904 hasConcept C42360764 @default.
- W2102502904 hasConcept C548081761 @default.
- W2102502904 hasConcept C60100273 @default.
- W2102502904 hasConceptScore W2102502904C112950240 @default.
- W2102502904 hasConceptScore W2102502904C119599485 @default.
- W2102502904 hasConceptScore W2102502904C120793396 @default.
- W2102502904 hasConceptScore W2102502904C127413603 @default.
- W2102502904 hasConceptScore W2102502904C159985019 @default.
- W2102502904 hasConceptScore W2102502904C176177977 @default.
- W2102502904 hasConceptScore W2102502904C192562407 @default.
- W2102502904 hasConceptScore W2102502904C2777899904 @default.
- W2102502904 hasConceptScore W2102502904C36759035 @default.
- W2102502904 hasConceptScore W2102502904C42360764 @default.
- W2102502904 hasConceptScore W2102502904C548081761 @default.
- W2102502904 hasConceptScore W2102502904C60100273 @default.
- W2102502904 hasIssue "2" @default.
- W2102502904 hasLocation W21025029041 @default.
- W2102502904 hasLocation W21025029042 @default.
- W2102502904 hasOpenAccess W2102502904 @default.
- W2102502904 hasPrimaryLocation W21025029041 @default.
- W2102502904 hasRelatedWork W1975608897 @default.
- W2102502904 hasRelatedWork W1998029461 @default.
- W2102502904 hasRelatedWork W2000966266 @default.
- W2102502904 hasRelatedWork W2022177312 @default.
- W2102502904 hasRelatedWork W2051157305 @default.
- W2102502904 hasRelatedWork W2230009713 @default.
- W2102502904 hasRelatedWork W2387616028 @default.
- W2102502904 hasRelatedWork W2795554382 @default.
- W2102502904 hasRelatedWork W3122552578 @default.
- W2102502904 hasRelatedWork W4285731133 @default.
- W2102502904 hasVolume "60" @default.
- W2102502904 isParatext "false" @default.
- W2102502904 isRetracted "false" @default.
- W2102502904 magId "2102502904" @default.
- W2102502904 workType "article" @default.