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- W2102564688 abstract "Successful integration of ultra low-k materials in Cu/low-k interconnect systems plays a key role for the next generation of highly integrated circuits of the 65 nm and 45 nm technology nodes with high operation speed. The main goal of this is the improvement of the transmission features of the interconnect system between devices, global wires and systems. Processing by Cu-DAMASCENE technique requires stability of the dielectric films against chemical, thermal and mechanical attack. To overcome the conventional limitations for processing will be a great challenge for establishing a new dielectric material for integration. The objective of this paper is to expose the potential of mesoporous SiO2 dielectric films concerning functional properties and technological behaviour." @default.
- W2102564688 created "2016-06-24" @default.
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- W2102564688 date "2006-04-01" @default.
- W2102564688 modified "2023-09-28" @default.
- W2102564688 title "Mesoporous SiO2 as low-k dielectric for integration in Cu/low-k interconnect systems" @default.
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- W2102564688 doi "https://doi.org/10.1002/vipr.200690028" @default.
- W2102564688 hasPublicationYear "2006" @default.
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