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• W2102628974 abstract "A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. It outperforms the module integrated on printed circuit board (PCB) to meet high-power-density and high-output-power specifications. The DBC substrate attached to an air-cooled heat sink provides 2.35-°C/W thermal resistance to limit the temperature rise of semiconductors switches to 50°C. Compact layout with 2.89-nH common-source inductance and negative coupling between drain and source conductors eliminate self-turn-on from 420-A/µs di/dt. A 2-kW dc-dc boost converter which switched between 400 kHz to 1 MHz achieved a power density of 220 W/in3 and an efficiency of 98.4% by employing the switch module." @default.
• W2102628974 created "2016-06-24" @default.
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• W2102628974 date "2015-03-01" @default.
• W2102628974 modified "2023-09-25" @default.
• W2102628974 title "DBC switch module for management of temperature and noise in 220-W/in³ power assembly" @default.
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• W2102628974 doi "https://doi.org/10.1109/apec.2015.7104498" @default.
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