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- W2103118889 abstract "The effects of Cu substrate morphology and ageing on the cycle performance of a Sn-anode electroplated on a smooth, a pyramid and a nodule-type Cu substrate and aged at 200 °C for 0, 1, 5, 20 h in a vacuum were examined. The Sn-anode electroplated on the nodule-type Cu substrate and aged for 1 h exhibited the highest reversible capacity (up to ∼600 mAh g−1) and a stable cycle performance, which resulted from the enhancement in adhesion and electrical contact properties between the Sn layer and the Cu substrate by the mechanical interlocking effect of the nodule-type Cu substrate and also by the buffering effects of an intermetallic compound formed by the ageing process. However, when aged for longer than 1 h at 200 °C, the reversible capacity of the Sn-anode decreased significantly due to the formation of an inactive Cu3Sn phase, irrespective of the morphology of the Cu substrate." @default.
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- W2103118889 date "2006-09-01" @default.
- W2103118889 modified "2023-09-26" @default.
- W2103118889 title "Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating" @default.
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- W2103118889 doi "https://doi.org/10.1016/j.jpowsour.2005.11.064" @default.
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