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- W2103164292 abstract "A chip stacking process for three dimensional integration is reported. This process consists of solderless thermo-compression bonding and chemical plating to connect non-contacted Cu interconnection. The Cu bumps and micro stud structures are fabricated at top and bottom chips, respectively. The optimization of themo-compression bonding, followed by chemical plating is investigated. The optimized parameters obtained for thermo-compression bonding are bonding force, temperature, and time of 15kg, 350°C, and 60sec, respectively. It is found that Ni electroless plating can compensate the high variation produced by the combination of Cu bump and micro stud structure formation, which is confirmed by daisy chain electrical resistance measurement. Furthermore, Ni electroless plating can reduce the bump electrical resistance up to 15%." @default.
- W2103164292 created "2016-06-24" @default.
- W2103164292 creator A5001865744 @default.
- W2103164292 creator A5003298540 @default.
- W2103164292 creator A5014748211 @default.
- W2103164292 creator A5037693433 @default.
- W2103164292 creator A5068813459 @default.
- W2103164292 date "2011-05-01" @default.
- W2103164292 modified "2023-09-25" @default.
- W2103164292 title "Novel chip stacking process for 3D integration" @default.
- W2103164292 cites W2001870828 @default.
- W2103164292 cites W2051909620 @default.
- W2103164292 cites W2060406579 @default.
- W2103164292 cites W2079511937 @default.
- W2103164292 cites W2094177705 @default.
- W2103164292 cites W2106514741 @default.
- W2103164292 cites W2112465762 @default.
- W2103164292 cites W2119406609 @default.
- W2103164292 cites W2132268983 @default.
- W2103164292 cites W2143049777 @default.
- W2103164292 cites W2160895422 @default.
- W2103164292 cites W2162856332 @default.
- W2103164292 doi "https://doi.org/10.1109/ectc.2011.5898782" @default.
- W2103164292 hasPublicationYear "2011" @default.
- W2103164292 type Work @default.
- W2103164292 sameAs 2103164292 @default.
- W2103164292 citedByCount "2" @default.
- W2103164292 countsByYear W21031642922022 @default.
- W2103164292 crossrefType "proceedings-article" @default.
- W2103164292 hasAuthorship W2103164292A5001865744 @default.
- W2103164292 hasAuthorship W2103164292A5003298540 @default.
- W2103164292 hasAuthorship W2103164292A5014748211 @default.
- W2103164292 hasAuthorship W2103164292A5037693433 @default.
- W2103164292 hasAuthorship W2103164292A5068813459 @default.
- W2103164292 hasConcept C111919701 @default.
- W2103164292 hasConcept C119599485 @default.
- W2103164292 hasConcept C123745756 @default.
- W2103164292 hasConcept C127313418 @default.
- W2103164292 hasConcept C127413603 @default.
- W2103164292 hasConcept C159985019 @default.
- W2103164292 hasConcept C165005293 @default.
- W2103164292 hasConcept C178790620 @default.
- W2103164292 hasConcept C180016635 @default.
- W2103164292 hasConcept C185592680 @default.
- W2103164292 hasConcept C192562407 @default.
- W2103164292 hasConcept C24326235 @default.
- W2103164292 hasConcept C2776985018 @default.
- W2103164292 hasConcept C31258907 @default.
- W2103164292 hasConcept C33347731 @default.
- W2103164292 hasConcept C41008148 @default.
- W2103164292 hasConcept C49040817 @default.
- W2103164292 hasConcept C530198007 @default.
- W2103164292 hasConcept C59088047 @default.
- W2103164292 hasConcept C8058405 @default.
- W2103164292 hasConcept C94857076 @default.
- W2103164292 hasConcept C98045186 @default.
- W2103164292 hasConceptScore W2103164292C111919701 @default.
- W2103164292 hasConceptScore W2103164292C119599485 @default.
- W2103164292 hasConceptScore W2103164292C123745756 @default.
- W2103164292 hasConceptScore W2103164292C127313418 @default.
- W2103164292 hasConceptScore W2103164292C127413603 @default.
- W2103164292 hasConceptScore W2103164292C159985019 @default.
- W2103164292 hasConceptScore W2103164292C165005293 @default.
- W2103164292 hasConceptScore W2103164292C178790620 @default.
- W2103164292 hasConceptScore W2103164292C180016635 @default.
- W2103164292 hasConceptScore W2103164292C185592680 @default.
- W2103164292 hasConceptScore W2103164292C192562407 @default.
- W2103164292 hasConceptScore W2103164292C24326235 @default.
- W2103164292 hasConceptScore W2103164292C2776985018 @default.
- W2103164292 hasConceptScore W2103164292C31258907 @default.
- W2103164292 hasConceptScore W2103164292C33347731 @default.
- W2103164292 hasConceptScore W2103164292C41008148 @default.
- W2103164292 hasConceptScore W2103164292C49040817 @default.
- W2103164292 hasConceptScore W2103164292C530198007 @default.
- W2103164292 hasConceptScore W2103164292C59088047 @default.
- W2103164292 hasConceptScore W2103164292C8058405 @default.
- W2103164292 hasConceptScore W2103164292C94857076 @default.
- W2103164292 hasConceptScore W2103164292C98045186 @default.
- W2103164292 hasLocation W21031642921 @default.
- W2103164292 hasOpenAccess W2103164292 @default.
- W2103164292 hasPrimaryLocation W21031642921 @default.
- W2103164292 hasRelatedWork W1976923760 @default.
- W2103164292 hasRelatedWork W1983191281 @default.
- W2103164292 hasRelatedWork W1998798907 @default.
- W2103164292 hasRelatedWork W2016894076 @default.
- W2103164292 hasRelatedWork W2069822079 @default.
- W2103164292 hasRelatedWork W2103164292 @default.
- W2103164292 hasRelatedWork W2118368628 @default.
- W2103164292 hasRelatedWork W2141504104 @default.
- W2103164292 hasRelatedWork W2168721811 @default.
- W2103164292 hasRelatedWork W2333578219 @default.
- W2103164292 isParatext "false" @default.
- W2103164292 isRetracted "false" @default.
- W2103164292 magId "2103164292" @default.
- W2103164292 workType "article" @default.