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• W2103246618 abstract "<para xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink> This paper presents a double-sided liquid cooling scheme for power MOSFETs using Embedded Power packaging technology. A liquid module test bed has been built to create various convection conditions and is used with 600-V high-current MOSFET-based Embedded Power samples to test the effectiveness and feasibility of the proposed scheme. Compared with single-sided liquid cooling, an improvement of 45% to 60% in thermal resistance is experimentally shown, for Embedded Power with double-sided liquid cooling for a device loss between 5 and 300 W and 0.25 to 4.5 GPM water flow rate. The trend and concept is also validated with physics-based lumped parameter thermal models. </para>" @default.
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• W2103246618 date "2008-09-01" @default.
• W2103246618 modified "2023-10-17" @default.
• W2103246618 title "Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging" @default.
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• W2103246618 doi "https://doi.org/10.1109/tia.2008.2002270" @default.
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