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• W2103454759 abstract "In micromachining - microsystems applications the patterning of resist films with thickness of several tens of microns is common. The processing conditions of such thick resist films are quite different from the ones used in mainstream microelectronics. For example in the case of SU-8 the Post Apply Bake (PAB) should be done in two different temperatures in order to prepare a compact film with limited amount of remaining casting solvent. In this direction several processing tools have been developed. In the present work an integrated processing tool for the application of thick resist films and their thermal processing (PAB and Post Exposure Bake, PEB) is presented. In addition, the tool is equipped with a single wavelength interferometer to monitor in real-time the film thickness variations during the thermal processing steps in order to optimize the processing conditions towards the lithographic performance. The preparation of two epoxy based resists is characterized and first lithographic results using this tool are presented." @default.
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• W2103454759 date "2010-05-01" @default.
• W2103454759 modified "2023-10-03" @default.
• W2103454759 title "Integrated tool for the spreading, thermal treatment and in situ process monitoring of thick photoresist films" @default.
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• W2103454759 doi "https://doi.org/10.1016/j.mee.2009.11.042" @default.
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