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• W2103754082 abstract "Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF( self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material." @default.
• W2103754082 created "2016-06-24" @default.
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• W2103754082 date "2004-01-01" @default.
• W2103754082 modified "2023-09-23" @default.
• W2103754082 title "Design and Comparison of Various Passive Components of a 5GHz Wireless LAN Applications" @default.
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